Hillsboro, Ore.—TriQuint Semiconductor Inc. has developed the first two members of its HADRON II PA module family, the TQM7M5012 and TQM7M5005, for 3G wedge phones.
The second-generation EDGE PAs are designed using TriQuint's CuFlip copper bump technology, improving RF performance while reducing current consumption to provide longer device battery life. Debuting with a 5x5mm footprint, the TQM7M5012 and TQM7M5005 are 50 percent smaller than the previous generation, providing handset manufacturers additional board space to add other rich features.
The HADRON II PA module family will be displayed at the GSMA Mobile World Congress in Barcelona, Spain.
Available in EDGE-Polar and EDGE-Linear versions, both products have been optimized to deliver optimum current consumption in the critical GMSK mode, which significantly improves handset battery life.
The TQM7M5012 for EDGE-Polar applications is aligned with Qualcomm's newest 3G multimode transceivers. Compared to the previous generation, TQM7M5012 offers even lower Rx band noise power level to help eliminate external components in the radio. The TQM7M5005 is designed to work with some leading 2.5G and 3G transceivers that require a linear power amplifier.
TriQuint has developed RF radio application and evaluation boards for both the TQM7M5012 and the TQM7M5005 to demonstrate the features and compatibility of the devices, enabling phone manufacturers to shorten handset development time.
Availability: Sampling to lead customers; production is planned for the first half of 2008.
Datasheets: TQM7M5012 and TQM7M5005.
TriQuint Semiconductor, www.triquint.com
