IoT groups combine efforts in emerging fragmented market: Page 3 of 3

November 30, 2015 // By Rick Merritt, EE Times
The Open Interconnect Consortium (OIC) will acquire assets of and combine its technologies with those of the Universal Plug and Play Forum (UPnP), a fifteen-year old group focused on automating links between PCs and peripherals typically over Wi-Fi. By adopting the UPnP’s widely used service discovery software and likely many of its members, OIC will bolster its position as an applications-layer software stack for the Internet of Things.
The OIC/UPnP deal was a good fit in part because Intel was a prime mover helping form both groups. AllSeen was originally a project of archrival Qualcomm.

The World Wide Web Consortium is working on its own recommendations for application-layer software for IoT. Richmond suggested OIC is in a good position to be adopted for the effort. “They are good at using specs by reference and [implementations based on] Javascript,” he said.

As part of the deal, OIC will form a new UPnP Work Group to maintain the UPnP specifications, and certification tools within the overall OIC organization. OIC will offer legacy UPnP certification for a fee to companies who choose not to join OIC.

— Rick Merritt, Silicon Valley Bureau Chief, EE Times

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