The European journal for the microwave and
wireless design engineer

April 2006

RFID Developments
Breakthrough in Plastic Electronics, SOI
Technology Significantly Reduces Size,
A 'Universal Reader' Chipset,
The-Package-Is-The Tag
A Wi-Fi RFID SoC

Technology Antennas: Side Lobe Control The Key To Dense Microwave Networks
A quantitative study by the Swiss Federal Office of Communications
(OFCOM) reveals ultra high-performance microwave antennas lead
the way when it comes to controlling radio link interference and
network densification.

Technology Antennas: Integrated 6-in-1 Antennas – Enabling the Virtual Office on Trains As wireless services are about to become available virtually everywhere, modern day train passengers expect to use their mobile phones, PDAs, notebooks and other devices for making calls from the train and having access to Internet, e-mail and infotainment applications when travelling. Demand from busy executives for a ‘virtual office’ on trains is encouraging train operators to provide this access as a useful value-added service, not forgetting the potential extra revenue stream.

Technology Antennas
A Sector Array to Increase Network Capacity,
Optimised Chip Antennae
An Antenna That Boosts in UHF RFID Readers

Identify RF/Microwave Design Problems Early Using Spectral Domain System Simulation Despite advances in simulation technology, RF/microwave system and architecture design is still being done in spreadsheets, math packages, custom software tools, and DSP based time domain tools. This approach is error prone and often leads to multiple design iterations. Each iteration costs time and money. Design intervals are shrinking and quality expectations are rising. Companies are forced to use this approach because of the lack of integrated software that supports top down RF design.

Building a 3.3 to 3.8 GHz 802.16a WiMAX LNA on FR4 Material
This article presents the design of a 3.3-3.8 GHz LNA suitable for IEEE 802.16a WiMAX customer premise equipment (CPE) and base transceiver stations (BTS), built on inexpensive FR4 copper laminate epoxy glass board material.

Low Cost ISM-Solution for OEM Customers in Europe Delivers Technical Innovation Integration Associates has signed an agreement with CompoTRON Germany, a technical distributor focused on selling advanced solutions for communication in Europe. Here we review the technical aspects of these ISM solutions.