The European journal for the microwave and
wireless design engineer

November 2005

Developments in 3G and Beyond Focus on Integration
A single Chip EDGE Transceiver, Silicon-on-Sapphire Betters 3GPP Specifications, WiMAX Goes Mobile ...

Satellite RF Front End in a Single Chip

Component Tolerance Optimization Problem
For any electronic design that involves discrete components - typically capacitors, inductors and resistors - we have the problem of tradeoff between price and component tolerance. A failsafe approach would be to select the best available components, but this typically leads to poor cost efficiency. This is due to the fact that the overall design performance has different sensitivity with respect to different component tolerances. For a good balance, it is essential to know which components are critical.

Speed Up Power Amplifier Design by Fast Source-Pull, Real-Time Load-Pull and Accurate Measurement-Based Behavioural Models
This article describes an alternative which overcomes the drawbacks of the existing state of the art source- and load-pull techniques with respect to speed. Also the proper integration of this data into simulators is addressed, both with respect to ease and accuracy.

RF System Issues in Wireless Sensor Networks
This paper addresses and discusses RF issues in wireless sensor system design and deployment. Such issues include the impact of the RF propagation channel on the communications range, where the sensor nodes are hidden or covered with vegetation, or any other obstructing objects. Other issues which impact the communications range include the effect of intra-system and inter-system interferences on the system throughput, the impact on the radiation pattern due to covered nodes, and the operating frequency. An additional issue includes the impact of the modulation scheme on the RF transmit power and the power consumption.