Below are an overview of the contents of this issue
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09 Comment
10 News
12 Cover Feature: DigRF v3 cross domain measurement solutions for mobile wireless R&D
Digital serial interfaces are transitioning from the ASIC designers to the silicon foundries as development teams race to see who can deploy the first DigRF v3 compliant RF-ICs and baseband-ICs (BB-ICs). DigRF v3 is the recently released digital serial interface standard between RF-ICs and BB-ICs. To this end, Agilent Technologies offers cross domain solutions to RF-IC designers, BB-IC designers and handset integrators deploying the DigRF v3 standard.
14 Radio: Multi-function 38 GHz packaged chipsets meet the performance demands and the cost-challenge for current and future radio requirements
MMIC chipsets, either bare die or packaged, form a large part of the cost for the radio systems. To this end, Mimix Broadband presents a highly integrated, multi-function packaged chipsets for 38 GHz that meet the performance demands and the cost-challenge for current and future requirements.
18 Next Generation Wireless: The wireless world in 2012: an Olympic dream
Five years from now, what wireless technologies will we use? What services and entertainment will we access? And how do we get there from here? In this article, the authors address these questions by imagining a day at the 2012 Olympics.
24 High-performance, low-power active mixer converts frequencies for 3.3GHz to 3.8GHz WiMAX applications
Solutions that perform frequency upconversion and downconversion in the 3.3 to 3.8 GHz frequency range are described and their measured performance is presented.
28 Improving integration in the RF chain
The push for smaller and slimmer mobile handsets is driving the need for greater integration in their internal circuitry, however the RF signal chain has traditionally been the most difficult to integrate.
30 SoC for short range wireless CMOS versus SiGe
33 Teardown: Handset makes use of good design practices, especially in the critical RF subsystem
36 Products
