The European journal for the microwave
and
wireless design engineer
November 2004
In Focus:
CMOS
reaches GSM antenna
- Peregrine Semiconductotr
RF
components see higher integration, but growth flat
-Strategy Analytics
Cover feature:
Cellular
handset RF integration
- William Krenik, Dennis Buss and Peter Rickert, Texas
Instruments
Technology Focus: Filter and Receiver
Technology
BAW
filters ready to sweep the board
Agilent Technologies; EPCOS; Infineon;
Philips Semiconductors
Application Focus: 3G and Beyond
The
future of broadband communication: two worlds coming
together
Joe Barrett, Flarion Technologies
Technology
choices in RF integration
Pieter Hooijmans,Philips
Semiconductors
As mobile device manufacturers strive to pack more and more
functionality into their products, the RF modules that provide these
products with wireless connectivity must begin to reach IC-size
proportions. Mobile devices not only need to free up internal space
to accommodate new multimedia features such as cameras and audio
players. The trend towards multi-band multi-mode wireless operation
means they need more than one complete RF transceiver inside them.
Overcrowding in current unlicensed bands together with the need to
achieve higher data rates on wireless links also means that the RF
carriers used in new consumer-product systems are moving to higher
frequencies. Higher frequency operation and much higher levels of
device integration are therefore the two major challenges that face
the RF solutions industry.
