The European journal for the microwave
and
wireless design engineer
October 2004
In Focus:
CMOS
brings higher integration
- Peregrine Semiconductor, Philips Semiconductors
Technology Focus: Test and Measurement
Taking
the stress from TETRA test
- Aeroflex
Wideband
modulation moves to mm-wave
- Agilent Technologies
Instruments
take LAN platform
- Agilent Technologies, LXI Consortium, VXI Technology
WLAN
tester matches up to manufacturing
LitePoint
Architecting
performance in high end signal analysis
- Andy Standen, Anritsu
Application Focus: Satellite
Communications
Galileo
satellite launch in view
- European Space Agency
Cover Feature
Real-time
spectrum analysis architecture takes a fresh look at RF signals
Among the measurement challenges that
spawned the differing spectrum analysis architectures that co-exist
today are signals defined by modulation and other time-varying
characteristics. Engineers need to trigger on fastchanging
frequency-domain characteristics, to capture information about signal
behaviour over time, and to analyse dynamic events. Real-time
spectrum analysis (RTSA) architecture combines these capabilities,
and this paper explains what makes this type of analysis work, as
well as some of the benefits of real-time acquisition.
AWG
noise source for production testing of SOC
transceivers
The noise figure measurement technique outlined in this paper
illustrates the replacement of the traditional diode-type noise
source with a noise signal generated by an RF arbitrary waveform
generator. This implementation has properties that lead to
production-worthy, fast noise figure measurements, thereby reducing
test time and lowering cost of test. Additionally, the elimination of
a noise source on the load board improves its integrity and
reliability.
A
practical approach for implementing microwave multilayer structure
simulation
Multilayer circuits provide a
convenient means of integrating a large number of circuit functions
into a small package, but can be quite complex to model and optimise
using circuit and electromagnetic simulators. This paper presents a
practical approach for implementing a simulation method for high
frequency multilayer assemblies, which is general and can be applied
to many simulators. The design of a patch antenna with a threelayer
substrate is used as an example.
