Israeli wireless chip group raises another $8 million By John Walko EE Times Europe September 05, 2008 (09:29 AM EST)   Recent Articles News Mobile phone service first in UK for underground commuters in Glasgow Comsys baseband IC powers dual-mode mobile WiMAX/EDGE device at CES IBM claims fastest graphene transistor GaAs device sector set for 5% fall in '09 Bluetooth chip market to reach $2 billion in 2009 Reading between the frequency lines Archives LONDON — Israeli wireless processors specialist ASOCS has raised $8 million in second-round funding, bringing to $20 million the investment raised to date by the company that has developed a software-based modem that will work on numerous air interfaces and is based on patented algorithms. The round was led by FinTech GIMV Fund (FGF) and included existing investors Vertex Venture Capital and Harel Hertz Investment House. ASOCS said it will use the extra investment to expand its presence in the Japanese and US markets as well as on further product development. "Lead by Japan, consumer electronics is a key market for the multiple-standard wireless connectivity provided by our MultiComms processor," said Gilad Garon, ASOCS CEO. Founded in 2003, ASOCS has partnered with leading chip makers, as well as hardware, software and module developers to provide a complete wireless MultiComm system-on-a-chip (SoC).