“Advanced packaging is showing a total revenue CAGR higher than the total packaging industry (3-4%), semiconductor industry (4-5%) and generally the global electronics industry (3-4%)”, comments Andrej Ivankovic, Technology & Market Analyst at Yole.
“Companies are today managing production costs and enlarging their portfolio. In parallel, advanced packaging players are expanding their activities toward the emerging markets thanks to mergers and acquisitions…,” he adds.
Drivers of the advanced packaging industry include IoT, automotive, 5G connectivity, AR/VR , and AI, amognst others.
“The fastest growing advanced packaging platform is Flip Out (FO) with 36% followed by 2.5D/3D TSV with 28%”, says Andrej Ivankovic from Yole. “Therefore FO platforms and 2.5D/3D TSV solutions are expected to exceed respectively US$3 billion and US$ 1.3 billion by 2022.”