90-W GaN avionics power module

July 14, 2014 // By Jean-Pierre Joosting
M/A-COM Technology Solutions has announced the latest entry in its portfolio of GaN in Plastic power module products. Optimized for pulsed avionics applications in the 960 to 1215 MHz band, this 2-stage, fully matched GaN surface mount power module scales to peak pulse power levels of 100 W in a 14 x 24 mm package size.

The company’s high gain GaN in Plastic power modules support surface mount technology (SMT) assembly, providing significant cost and process advantages compared to ceramic-packaged flange-mount components. Delivering clear benefits in size, weight and power (SWaP) while enabling high volume manufacturing efficiency, the GaN power modules feature a Land Grid Array (LGA) pattern for enhanced thermal flow and “True SMT” assembly and do not require copper coining or complicated thermal management techniques on the system PC board.

Under pulsed conditions, these modules deliver output power greater than 90 W, with 30 dB a typical associated power gain and 60% typical power added efficiency. Supporting 50 V operation and up to 3 ms pulse width/duration for improved signal flexibility, GaN in Plastic power modules reduce overall power consumption and cooling requirements compared to existing options.