Bluetooth® low energy IC targets automotive applications: Page 2 of 2

December 06, 2017 // By Jean-Pierre Joosting
AEC-Q100 compliant for automotive applications, the latest Bluetooth® Low Energy (LE) IC from Toshiba Electronics Europe meets core specification 4.2 and includes support for secure connection, LE privacy features and extended packet length.

The wettable flank package supports the 100 percent automatic visual inspection needed to deliver the high levels of soldering quality required to withstand vibration experienced in automotive applications.

Current applications include remote key systems and reducing cables by providing a reliable wireless connection to sensors. The device will also facilitate remote connection to diagnostic equipment, creating a Bluetooth® ‘soft’ On-Board Diagnostic (OBD) port, thereby saving the cost and weight of the associated cabling and OBD connector.

The TC35679 accepts a wide range of supply voltages (1.8- to 3.6-V) making it ideal for automotive applications. Operating temperature range is -40˚C to 105˚C for input voltages from 2.7- to 3.6-V and -40˚C to 85˚C from 1.8- to 3.6-V.

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