Based on SMIC's 55nm ULP+RF+eFlash (Ultra Low Power+ Radio Frequency +embedded Flash) technology, the chip can be extensively used in wireless meters, shared bikes, smart appliances, smart city, smart agriculture, and in other IoT fields.
The SMIC 55nm ULP+RF+eFlash technology platform is focused for use on ultra-low-power IoT applications. The process and performance improvements are based on the stable 55nm logic and mix-signal technologies. The nominal operating voltage can be lowered 30 percent and the device will reduce 45 percent of dynamic power consumption, and 70 percenrt of static power consumption, as well as lowering the SRAM leakage. Furthermore, the platform is compatible with RF and eFlash technologies and offers complete IP systems. Compared with other technology nodes, SMIC 55nm ULP+RF+eFlash technology is a reliable platform for low power IoT SoC design – it can meet the strict requirements of NB-IoT for low stand-by power consumption and small package size.
RoseFinch7100 is specially designed for extensive low power IoT applications. Its sleep power is 2 μA ,which accounts for 16 percent of its total power consumption while sending and receiving message once per day. In addition, RoseFinch7100 uses single chip design with minimum peripherals and supports R14 full band with integrated cloud-chip security performance as well as open application architecture.
"This achievement fills the gap in the China market and conforms to SMIC's consistent IoT technology development strategy as well," said Mr. Mike Rekuc, Executive Vice President of Worldwide Sales & Marketing, SMIC. "By integrating ULP, RF and embedded flash technologies, SMIC's 55nm platform is highly suitable for NB-IoT and other IoT chip products and can meet customers' demands for power and performance."