Disruptive process for assembling SIM cards cuts costs: Page 2 of 2

November 01, 2017 //By Jean-Pierre Joosting
Dramatically simplifying the card assembly process and eliminating the need for substrates, Secure Authenticable Identification Laminates (sAiL)™, developed by Singapore-based smart card innovator NovoFlex, is a patented, groundbreaking new process that redefines how IC chips will be embedded into SIM cards currently used in the telecommunications sector.

CIPTA CEO Steven Chandra said: "Our mission at CIPTA is to harness innovation to empower ordinary individuals. Driven by innovation, in the last few years, applications for smart cards have proliferated across industries. Technologies such as sAIL™ are a game changer, and we are glad to be working with strategic partners such as NovoFlex to help us to envision a brighter, bolder future."

The process has been successfully patented in 20 countries, with more countries pending, and has already garnered interest from major SIM card vendors across the globe. While initial demand for sAIL™ is expected from the telecommunications sector, NovoFlex is already working with key industry players to apply the sAiL™ technology to banking cards and is confident that its usage will expand to transportation and Internet of Things (IoT) in the near future.

www.novoflex.com