Surface mount configurations lend themselves to higher-efficiency “pick and place” circuit board assembly processes versus the more laborious, multi-step thru-hole assembly methods. The introduction of the ER SMT series will enable faster assembly processing, thereby helping to reduce the cost of high-reliability electronic systems where ER components are utilized. The introduction of this new series also sends a message to the design community – that SMT designs are attainable even for some of the most challenging high-reliability components.
“This development from Gowanda not only breaks new ground but also helps to assure design engineers that their next generation designs will have access to the necessary components – especially since Gowanda plans to introduce more ER SMT designs in the future,” said Don McElheny, CEO of Gowanda Components Group.
The ER3013 series meets the military’s Qualified Products List (QPL) requirements for Established Reliability to failure rate level M and addresses three MIL-PRF-39010 slash numbers (/19, /20 and /21). This qualification required extensive testing for electrical, environmental, mechanical and thermal performance. Level M represents the first level of failure rating for off-the-shelf inductors for high-reliability applications. In its ongoing commitment to the military market, Gowanda intends to achieve higher level failure ratings (Level P, then Level R) as ongoing testing continues to accumulate the hours necessary to attain those ratings on this ER SMT series.