These QFN packages are available in six sizes from 3 to 8 mm with standard JEDEC MO-220 footprints. They feature broadband low-loss transitions for superior performance over frequency. Maximum insertion loss is 0.5 dB from DC to 18 GHz, 1.5 dB from 18 to 35 GHz and 4 dB from 35 to 40 GHz.
HTCC construction provides for enhanced mechanical strength and higher thermal conductivity compared to LTCC packages. These extremely rugged packages are available with either a plain seal for epoxy or metallized grounded seal ring for solder lid attachment. Lids are available from the factory. Additional options include castellations and custom pin counts. Standard plating is gold over nickel.