Claiming to be the industry's first halogen-free multi-layer board material for RF power amplifiers, it is designed to contribute to compact-sizing and stable operation of wireless base stations.
In the fifth-generation mobile communication system ("5G"), currently being developed for implementation in 2020, data communication by a variety of equipment such as smartphones is predicted to require a much greater capacity and higher transmission rates. For 5G communication, demand for "small cells ", small base stations that can cover hot spots with high user demand, is expected to expand substantially. RF power amplifier boards used in compact-sized small cells will require a multi-layer structure to achieve further space saving in place of the current mainstream double-sided boards. The industry also requires multi-layer boards that can carry out high-speed communication in high frequency domains while providing low transmission losses as well as low heat generation. Panasonic's proprietary resin design technology has enabled the industry's first commercial production of multi-layer circuit board material for RF power amplifiers by providing halogen-free, low transmission loss and high thermal conductivity features that, up to this point, have represented a major technical barrier.
The material exhibits -20 dB/m transmission loss at 20 GHz. Thermal conductivity is 0.6 W/(m·K) – 1.5 times that of the Panasonic's conventional product – enabling effective dissipation of heat from hot components used on the power amplifier to provide reliable operation.
The material protects against deterioration of transmission characteristics in high-temperature environments, thereby contributing to the long-term durability of the base stations.Dielectric constant change rate is 1.0%, while dissipation factor change rate is 3.5% (1000 hours at 125°C). This is in contrast to dielectric constant change rate of current products of 3.0%, and issipation factor change rate of current products of 80% (1000 hours at 125°C).