These molded ceramic packages come in over 200 standard outlines, dramatically increasing the packaging options for GaN devices. StratEdge also offers complete automated assembly and test services for these packages, including gold-tin solder die attach.
GaN devices are traditionally packaged in the company's LL family of high-power laminate copper-moly-copper (CMC) base packages with a ratio of 1:3:1 CMC. These packages accommodate frequencies up to 63 GHz. In the molded ceramic package, the standard Kovar® base can be replaced with CMC. For frequencies of 18 GHz or less, using a molded ceramic package provides the advantages of hermeticity, a broad array of outline packages, and lower cost, while the CMC provides the heat dissipation needed for GaN devices to meet requirements for aerospace applications. For SMT applications, these packages can be manufactured with gull-wing formed leads. They offer flexibility because it's inexpensive to change the lead design to match an existing footprint.
"StratEdge has hundreds of molded ceramic MC Series packages in standard, open-tooled configurations, which are all MIL-STD hermetic," said Tim Going, StratEdge president. "By swapping out their bases with CMC, you get a low-cost, high-power, fully hermetic packaging solution."