New MEMS approaches are required for IoT: Page 3 of 3

June 04, 2015 // By Peter Clarke
New kinds of MEMS are needed to drive growth in sensors and the Internet of Things, according a panel of speakers due to convene at the Semicon West event due to be held July 14 to 16 in San Francisco, California.
“There’s a big gap between the costs the MEMS market requires, and the advanced CMOS equipment available,” he said, noting the need for such things as simpler, lower-cost TSV processes than those developed for advanced CMOS.

Dalsa is working with Alchimer to develop a low cost wet-process copper via-last MEMS TSV approach. “We need closer collaboration between MEMS makers and equipment and materials suppliers to work on the lower cost approaches we’ll need going forward,” he said.

At Semicon West, the “What’s Next for MEMS?” program will be discussed by the above speakers. Other TechXpot programs at Semicon will look at the impact of the IoT on the semiconductor industry, the status of next generation non-volatile memory, and biomedical and automotive applications.

In addition, SEMI (the trade association formerly known as Semiconductor Equipment and Materials International) and the MEMS Industry Group invite interested parties to a participatory workshop at Semicon West on July 15 to explore potential collaborative options to help support sector growth going forward. “There are now compelling business reasons to develop standards for the MEMS sector,” noted Alissa Fitzgerald of AM Fitzgerald & Associates, who will keynote at the workshop.

Paula Doe is director of technology at the industry association SEMI. This article was first published on


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