V13 provides key new capabilities and major enhancements to better address the design challenges associated with highly-integrated RF/microwave components commonly found in communications, phased-array radar and other electronic systems.
V13 also introduces numerous innovations in design flow management and simulation, supporting monolithic microwave integrated circuit (MMIC), RFIC, multi-chip module and printed circuit board (PCB) technologies. Simulation capabilities have been expanded within the Microwave Office APLAC harmonic balance (HB) and Visual System Simulator™ (VSS) system-level simulation engines and speed improvements have been made to both its AXIEM planar 3D and Analyst™ arbitrary 3D electromagnetic (EM) solvers.
Design automation and simulation have been enhanced for multi-chip modules, with greater support for multi-technology process design kits (PDKs) within a single project, new support for OpenAccess (schematic) databases and APLAC co-simulation support for Spectre RFIC netlists, as well as simplified EM layout and port creation. For PCB design, a new import wizard supports ODB++ and IPC2851 databases to provide interoperability with mainstream third-party PCB layout tools. New layout editing capabilities have also been added, along with simplified multi-technology management. Furthermore, the new EM Socket II architecture within V13 offers improved third-party EM simulation flows for AWR Connected™ partner solutions from ANSYS, CST and Sonnet, giving designers access to alternate EM simulators within NI AWR Design Environment.