Rogers to show circuit and thermal management materials at DesignCon 2017

January 17, 2017 // By Jean-Pierre Joosting
Rogers Corporations Advanced Connectivity Solutions will be featuring examples of its high-performance circuit and thermal management materials for the most demanding electronic designs and working environments at DesignCon 2017.

Representatives from Rogers will be available to offer insight and advice on the optimum use of their materials, including the 92ML™ series, COOLSPAN® TECA, RO3003™ and CLTE-XT™ materials. The 92ML materials, for example, can help meet some of the most challenging thermal management issues. With a glass transition temperature (Tg) of +160°C and high thermal conductivity of 2.0 W/m·K, 92ML materials can be supplied with copper cladding up to 4 ounce thickness, to handle the most demanding heat-transfer requirements in power supplies and automotive electronics. When even greater cooling capability is needed, 92ML StaCool™ laminates are available with an insulated metal substrate (IMS). The IMS heatsink can be machined to a customer’s requirements, serving as part of the mechanical design in the final application.

COOLSPAN TECA adhesive film for bonding heatsinks to circuit materials with reliable thermal interfaces is a lead-free-process-compatible thermoset, epoxy-based, silver-filled adhesive film that features outstanding thermal conductivity of 6 W/m·K to ensure thermally stable bonds between heatsinks and PCB materials. COOLSPAN TECA represents a practical alternative to fusion bonding, sweat soldering, press-fit, and other methods for attaching circuits to heatsinks and other mechanical structures.

RO3003™ 5 mil thick laminates are ideal for loss-critical millimeter wave frequency designs, where consistent circuit performance matters, such as automotive radar sensors and point-to-point microwave backhaul-communications systems. While already a benchmark for 77 GHz automotive radar sensors, RO3003 3.0 dielectric constant (Dk) laminates are available with ½ ounce and 1 ounce rolled copper foil. Combining the very low dielectric loss of the RO3003 PTFE-ceramic resin system with smooth foil results in high frequency circuit materials with best-in-class insertion loss.