Representatives from Rogers will be available to offer insight and advice on the optimum use of their materials, including the 92ML™ series, COOLSPAN® TECA, RO3003™ and CLTE-XT™ materials. The 92ML materials, for example, can help meet some of the most challenging thermal management issues. With a glass transition temperature (Tg) of +160°C and high thermal conductivity of 2.0 W/m·K, 92ML materials can be supplied with copper cladding up to 4 ounce thickness, to handle the most demanding heat-transfer requirements in power supplies and automotive electronics. When even greater cooling capability is needed, 92ML StaCool™ laminates are available with an insulated metal substrate (IMS). The IMS heatsink can be machined to a customer’s requirements, serving as part of the mechanical design in the final application.
COOLSPAN TECA adhesive film for bonding heatsinks to circuit materials with reliable thermal interfaces is a lead-free-process-compatible thermoset, epoxy-based, silver-filled adhesive film that features outstanding thermal conductivity of 6 W/m·K to ensure thermally stable bonds between heatsinks and PCB materials. COOLSPAN TECA represents a practical alternative to fusion bonding, sweat soldering, press-fit, and other methods for attaching circuits to heatsinks and other mechanical structures.
RO3003™ 5 mil thick laminates are ideal for loss-critical millimeter wave frequency designs, where consistent circuit performance matters, such as automotive radar sensors and point-to-point microwave backhaul-communications systems. While already a benchmark for 77 GHz automotive radar sensors, RO3003 3.0 dielectric constant (Dk) laminates are available with ½ ounce and 1 ounce rolled copper foil. Combining the very low dielectric loss of the RO3003 PTFE-ceramic resin system with smooth foil results in high frequency circuit materials with best-in-class insertion loss.