Tiny multilayer diplexer for WLAN and Bluetooth circuits

March 12, 2014 // By Jean-Pierre Joosting
TDK Corporation has developed a multilayer diplexer in case size IEC 1005 for the implementation of 2.4 GHz and 5 GHz band WLAN in smartphones and other mobile devices.

With its miniature dimensions of only 1.0 mm x 0.5 mm x 0.4 mm the DPX105950DT-6010B1 diplexer claims to be the smallest in the industry.

The volume of the diplexer is more than 60 percent smaller than existing 1608 diplexers. In spite of the significant size reduction, the tiny diplexer provides equal or even better insertion loss and attenuation performance. For example, the maximum low band insertion loss at 2.4 to 2.5 GHz is just 0.5 dB, while the high band attenuation in the same frequency range is at least 25 dB. Mass production of the diplexer started in February 2014.

Used in the antenna input/output section to divide or combine two different frequency bands, the diplexer features a combination of layers with different dielectric constants, which are produced using TDK’s co-firing technology. The company was able to further miniaturize its diplexer by using even thinner ceramic layers and finer conductor lines. The product is rated for an operating temperature of -40°C to +85°C and is suitable for use in the Bluetooth and WLAN circuitry in mobile devices.