Bluetooth® low energy IC targets automotive applications

December 06, 2017 // By Jean-Pierre Joosting
AEC-Q100 compliant for automotive applications, the latest Bluetooth® Low Energy (LE) IC from Toshiba Electronics Europe meets core specification 4.2 and includes support for secure connection, LE privacy features and extended packet length.

The IC is available for use in harsh automotive environments and extended temperature ranges. The mixed-signal TC35679IFTG contains both analog RF and baseband digital parts to provide a complete system in a single, compact and low-profile, 40-pin, 6- x 6- x 1-mm QFN ‘wettable flank’ package, with a pin pitch of 0.5mm.

The TC35679 provides Bluetooth® Host Control Interface (HCI) functions alongside low energy GATT profile functions (as defined by Bluetooth®) specifications. Further, the IC becomes a fully-fledged application processor when used in conjunction with an external non-volatile memory, or can be used in combination with an external host processor.

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This Bluetooth IC is based on an ARM® Cortex®-M0 processor and includes a sizeable 384kB of on-board mask ROM to support the Bluetooth® baseband process and a further 192kB of on-board RAM for Bluetooth® application programs and data.

A key feature of the TC35679 is its ability to form part of sophisticated systems as a result of 17 General Purpose IO (GPIO) lines and multiple communications options including SPI, I2C and a 921.6 kbps, two-channel UART. The GPIO lines offer access to a range of on-chip features including a wake-up interface, four-channel PWM interface, 6-channel AD converter and the ability to control the control interface of an optional external power amplifier for applications requiring a longer reach. On chip DC-DC converter or LDO circuits adjust the external voltage supply to the required values on chip.

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See also: Smartwatches, Bluetooth headsets to drive high growth wearables market.