"More companies are turning to simulation to drive increasingly rapid and innovative product development and gain deeper insight into product design," said Mark Hindsbo, ANSYS vice president and general manager. "Our customers rely on ANSYS engineering simulation technology to cut costs, limit late-stage design changes, and tame the toughest engineering challenges. This latest release continues to build upon the industry's most accurate simulation portfolio, offering enhanced speed and accuracy – enabling more users, no matter their level of experience, to reduce development time and increase product quality."
Better antenna design
In the electromagnetics suite, a new visual ray tracing capability gives engineers insight to better understand how high-frequency electromagnetic waves interact with a large-scale environment. This technology is ideal for antenna placement studies and radar scattering simulations. In addition, a new RF Link Analysis is available for modeling the quality of wireless links in the presence of electromagnetic interference (EMI) and radio frequency interference (RFI). This release also introduces new wireless propagation loss models for outdoor and indoor scenarios that include effects such as rain, atmospheric absorption, building structure absorption and statistical signal fading models for urban settings.
Speeding up robust electronics design
With ANSYS 18.2, engineers can quickly solve larger classes of printed circuit boards and electronic package simulations thanks to the newly incorporated Phi meshing technology in the ANSYS® HFSS™ 3-D environment. ANSYS 18.2 provides further computational speed advancements with a new automated flow for multi-level, high-performance computing that provides users with highly scalable shared and distributed compute resources.