Qualcomm, Himax collaborate on 3D depth sensing camera

September 07, 2017 //By Rich Pell
Qualcomm (San Diego, CA) and Himax Technologies (Tainan City, Taiwan) have announced a collaboration to commercialize a high-resolution, low-power active 3D depth sensing camera system.

A fully integrated structured light module (SLiM) 3D solution, the system is designed to enable computer vision capabilities for applications such as biometric face authentication, 3D reconstruction, and scene perception for mobile, IoT, surveillance, automotive, and AR/VR. It combines Qualcomm's Spectra depth-sensing technologies and computer vision architecture and algorithm expertise with Himax's technologies in wafer optics, sensing, driver, and module integration capabilities.

Designed for very low power consumption in a compact, low-profile form factor, the SLiM is a turn-key 3D camera module that delivers real-time depth sensing and 3D point cloud generation with high resolution and high accuracy performance for indoor and outdoor environments. It is offered as ideal for embedded and mobile device integration.

"Our 3D sensing solution will be a game changing technology for smartphones, where we will enable the Android ecosystem to provide the next generation of mobile user experience," said Jordan Wu, President and Chief Executive Officer of Himax Technologies in a statement. "Our two companies have worked together for more than four years to design the SLiM 3D sensing solution to meet growing demands for enhanced computer vision capabilities that will enable amazing new features and use cases in a broad range of markets and applications."

Qualcomm Technologies and Himax plan to commercialize the SLiM 3D camera as a total camera system solution for a wide array of markets and industries with mass production targeted for Q1 of 2018.

Qualcomm
Himax Technologies