3-W SMT flip chip back-emitting VCSEL array

November 21, 2019 //By Jean-Pierre Joosting
3-W SMT flip chip back-emitting VCSEL array
TriLumina® has launched the first 3-W surface-mount, flip-chip, back-emitting VCSEL array without the need for a package submount or bond wires for mobile 3D sensing cameras.

This new VCSEL-on-Board (VoB) technology enables higher performance, smaller size and lower costs, and simplifies time-of-flight (ToF) camera supply chains as compared to conventional VCSELs for 3D sensing. The VoB SMT VCSEL array has the smallest footprint with the lowest cost implementation in its class, making it ideal for use in mobile devices.

Conventional VCSEL arrays are mounted on a submount and use bond wires for electrical connections. The 3-W VCSEL on board device is a compact, surface-mountable design, consisting of a single VCSEL array die that is flip-chipped with standard SMT to a printed circuit board (PCB) without the need for a submount carrier for the VCSEL die at the same time as other SMT components on the same PCB. TriLumina's integrated back-side etched micro-lenses enable integrated optics, which further reduces part height as compared to conventional VCSELs with separate optical lenses. It has the smallest footprint with the lowest cost implementation in its class, making it ideal for use in mobile devices.

Although direct flip-chip SMT technology has been used in other components such as RF and power FET chips, TriLumina's VoB is the first time this technology has been able to be used on a VCSEL device. The VCSEL device uses copper pillars with solder bumps that are currently in use for other types of products and mounts directly to a PCB using standard lead-free SMT, with the added benefit of built-in hermeticity and excellent thermal properties due to its unique back-emitting VCSEL structure. The VoB family of products is starting sampling now.

www.trilumina.com


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