The proposed purchase price was not disclosed but Ansys said that further details regarding the transaction and its impact on the 2019 financial outlook will be provided after the closing, which is expected in the first quarter of 2019.
Helic was founded in Athens, Greece, in 2000 and has developed analog/RF and high-frequency IC design engineers to synthesize inductive devices and model electromagnetic and parasitic phenomena. The company now has more than 50 employees, including locations in Greece, Japan and Ireland and considers Santa Clara as its corporate headquarters.
Ansys said the acquisition will complement its own engineering and high-frequency simulation portfolio and would enable the creation of products to address 5G and artificial intelligence applications.
The acquisition of Helic, combined with Ansys' flagship electromagnetic and semiconductor solvers, will provide a comprehensive solution for on-chip, 3D integrated circuit and chip-package-system electromagnetics and noise analysis.
Multi-die packaging for applications in communications and data centers is leading to closer proximity of high frequency circuits and greater risks of electromagnetic crosstalk. The combination of Ansys and Helic simulation should allow electromagnetic-aware design and precisely capture electromagnetic and parasitic effects from direct current up to 110 GHz and on sub-10nm manufacturing processes, Ansys said.
"Ansys customers will gain easy access to on-chip electromagnetics solvers, integrated with the flagship Ansys electronics and semiconductor tools," said Yorgos Koutsoyannopoulos, CEO of Helic, in a statement issued by Ansys.