The 3D image sensor assumes a key role in smartphones and for applications that rely on accurate 3D image data, including reliable face authentication, improved photo functions and authentic augmented reality experiences.
The latest REAL3™ single-chip 3D image sensor measures just 4.4 x 5.1 mm and is the fifth generation of successful time-of-flight deep sensors from Infineon. In addition to its small dimensions, which allow it to be incorporated into even the smallest devices with just a few elements, the chip provides the highest resolution data with low power consumption.
“With the fifth generation of our REAL3™ chip we are once again demonstrating our leading position in the field of 3D sensors,” says Andreas Urschitz, President of the Power Management and Multimarket Division at Infineon, which also includes sensor business. “It’s robust, reliable, powerful, energy efficient and at the same time decisively small. We see great growth potential for 3D sensors, since the range of applications in the areas of security, image use and context-based interaction with the devices will steadily increase.” The 3D sensor also allows the device to be controlled via gestures, so that human-machine interaction is context-based and without touch.