To tackle this problem Heraeus developed a new EMI shielding system, which is based on a silver ink printer that ensures a proper functioning of high-frequency on-board chips and their ultra-fast data transmission. The system consists of a special silver ink formula and a manufacturing machine that can apply the shielding coating followed by special ultraviolet and infrared equipment for curing.
“In a 5G world, the Heraeus EMI Shielding Solution is the most cost-effective answer for technology that is going faster, higher and further every day,” says Franz Vollmann, Head of Heraeus Printed Electronics.
The new EMI shielding technology from Heraeus saves considerable costs and effort in comparison to traditional shielding technologies like metal housings or vacuum-based sputtering. In contrast to sputtering, the protective silver layer is applied to the carrier object with sub-micrometer precision by using printing nozzles.
"Our new EMI shielding system will replace sputtering technology. It not only saves material and costs, but it also leads to a much better shielding performance. This is necessary for further miniaturization," says Franz Vollmann, Head of Heraeus Printed Electronics.
Silver inkjet-printing also offers further decisive advantages over sputtering in terms of cost and efficiency. The investment cost for the new Heraeus system is around US $500,000 (depending on the machine configuration), which is a fraction of the price of a sputtering system. At the same time, the number of units able to be produced per hour is between 12,000 and 15,000 – more than three times the output from a sputtering system.