Announced at at COMPUTEX, the integrated 5G chipset, with the MediaTek Helio M70 5G modem built in, packs world-leading technology into its compact design. The SoC includes Arm's latest Cortex-A77 CPU, Mali-G77 GPU and MediaTek's most advanced AI processing unit (APU) to meet the power and performance demands of 5G to deliver super fast connectivity and extreme user experiences.
The multi-mode 5G chipset is for 5G stand alone and non-stand alone (SA/NSA) sub-6GHz networks. It supports connectivity from 2G to 4G to bridge existing network access while 5G networks roll out globally.
"Everything about this chip is designed for the first wave of flagship 5G devices. The leading-edge technology in this chipset makes it the most powerful 5G SoC announced to date and puts MediaTek at the forefront of 5G SoC design," said MediaTek President Joe Chen. "MediaTek will power rollouts of 5G premium level devices."
The MediaTek 5G chipset integrates the previously announced Helio M70 5G modem to give device makers a comprehensive system for ultra-fast 5G in a power efficient package. MediaTek's single 5G chip design is superior to two chips solutions, especially in being able to deliver power efficient performance. The integrated Helio M70 modem supports LTE and 5G dual connectivity (EN-DC) with dynamic power sharing capability, plus multi-mode support for every cellular connectivity generation from 2G to 5G. It also has dynamic bandwidth switching technology that allocates 5G bandwidth required for specific applications to improve modem power efficiency by 50 percent and extend battery life.