NEC selects NXP RF Airfast multi-chip modules for 5G Massive MIMO

October 14, 2020 //By Jean-Pierre Joosting
NEC selects NXP RF Airfast multi-chip modules for 5G Massive MIMO
NXP RF Airfast multi-chip modules chosen by NEC for use in Massive MIMO 5G antenna radio unit for Rakuten Mobile in Japan.

NXP® Semiconductors N.V.,  and NEC Corporation have announced that NXP will supply RF Airfast multi-chip modules to NEC for use in a Massive MIMO 5G antenna radio unit (RU) for Rakuten Mobile, one of Japan’s leading mobile network operators.

The NEC Massive MIMO 5G antenna RU features a 5G open virtual radio access network (vRAN) interface and has been adopted by Rakuten Mobile for its fully virtualized cloud-native mobile network. The RU utilizes extremely accurate digital beam forming for efficient high-capacity transmission and is easy to install as a result of miniaturization achieved through an increased level of circuit integration.

The AFSC5G40E38 RF Airfast multi-chip module from NXP was developed to meet the frequency and power requirements of Japan’s 5G infrastructure deployment. The device is part of an expanding portfolio of NXP RF Airfast multi-chip modules being developed to enable 5G infrastructure deployments throughout the world. RF Airfast multi-chip modules offer a common footprint across frequency and power for different regions, enabling faster time to market for network mobile operators.


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