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NEC selects NXP RF Airfast multi-chip modules for 5G Massive MIMO

NEC selects NXP RF Airfast multi-chip modules for 5G Massive MIMO

Business news |
By Jean-Pierre Joosting



NXP® Semiconductors N.V.,  and NEC Corporation have announced that NXP will supply RF Airfast multi-chip modules to NEC for use in a Massive MIMO 5G antenna radio unit (RU) for Rakuten Mobile, one of Japan’s leading mobile network operators.

The NEC Massive MIMO 5G antenna RU features a 5G open virtual radio access network (vRAN) interface and has been adopted by Rakuten Mobile for its fully virtualized cloud-native mobile network. The RU utilizes extremely accurate digital beam forming for efficient high-capacity transmission and is easy to install as a result of miniaturization achieved through an increased level of circuit integration.

The AFSC5G40E38 RF Airfast multi-chip module from NXP was developed to meet the frequency and power requirements of Japan’s 5G infrastructure deployment. The device is part of an expanding portfolio of NXP RF Airfast multi-chip modules being developed to enable 5G infrastructure deployments throughout the world. RF Airfast multi-chip modules offer a common footprint across frequency and power for different regions, enabling faster time to market for network mobile operators.


NEC teamed up with Rakuten Mobile to develop and manufacture the 5G infrastructure that leverages NXP’s RF Airfast multi-chip modules.

“NXP 5G RF Airfast multi-chip modules support the frequencies and power levels needed for Japan’s 5G infrastructure,” said Kazushi Tsuji, Deputy General Manager of NEC’s Wireless Access Solutions Division. “The technology’s flexibility, integration and performance allow us to quickly and effectively develop radio products for 5G infrastructure.”

“At NXP, we always strive for technological leadership,” said Paul Hart, Executive Vice President and General Manager of NXP’s Radio Power Division. “This partnership underscores our vision to deliver advanced 5G experiences to countries around the world. NXP’s Airfast multi-chip modules offer high levels of integration, ease of use and performance for 5G infrastructure systems. No matter what frequency band or power.”

www.nec.com
www.nxp.com

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