The latest MGM210x and BGM210x Series 2 modules support leading mesh protocols and multi-protocol connectivity. They offer a one-stop wireless solution to improve mesh network performance for line-powered IoT systems ranging from smart LED lighting to home and industrial automation. Pre-certified for North America, Europe, Korea and Japan, the mesh networking modules minimize the time, cost and risk factors related to global wireless certifications. The xGM210x modules make it possible to accelerate time to market by several months, the company says. The modules are based on Silicon Labs’ Wireless Gecko Series 2 platform built around an Arm Cortex-M33 processor, best-in-class software stacks, a dedicated security core and a +125ºC temperature rating suited for harsh environmental conditions.
The Series 2 module portfolio’s initial families include the industry’s first pre-certified wireless modules optimized for LED light bulbs and a versatile printed-circuit board (PCB) form-factor module designed to meet the needs of a broad range of ultra-small IoT product designs, including inside LED bulb housings.
Secure boot with root of trust and secure loader technology helps prevent malware injection and rollback to ensure authentic firmware execution and over-the-air (OTA) updates. A dedicated security core isolates the application processor and delivers fast, energy-efficient cryptographic operations with differential power analysis (DPA) countermeasures. A true random number generator (TRNG) compliant with NIST SP800-90 and AIS-31 strengthens device cryptography. A secure debug interface with lock/unlock allows authenticated access for enhanced failure analysis. The module’s Arm Cortex-M33 core integrates TrustZone technology, enabling system-wide hardware isolation for trusted software architectures. Samples and production quantities of the xGM210P modules are available now, the xGM210L modules will be available in Q4 2019.