The collaboration combines each company’s technical leadership in performance, size reduction, ultra-low power consumption, and security to deliver breakthrough multi-receiver UWB products to the global market.
Renesas is augmenting its microcontrollers (MCUs) and RF connectivity capabilities with 3db Access’ field proven secure ranging UWB chips, which are designed for use in smartphones, smart watches, automobiles, and other IoT applications. This will accelerate a roadmap of ICs and modules that leverage both companies’ strengths and product portfolios to bring best-in-class UWB devices to market. The collaboration also gives Renesas customers access to advanced UWB products that are IEEE 802.15.4z dual HRP/LRP compliant and utilize an RF architecture that achieves 10x lower power consumption through the support of LRP-mode. 3db devices also provide the smallest silicon area compared to competitive ICs.
“We believe that our combined technical expertise, differentiated IP, and global operations will allow us to design the smallest and highest performance system solutions that provide secure distance ranging access to our customers’ next-generation products,” said Dr. Amit Bavisi, Vice President of Engineering, IoT and Infrastructure Business Unit at Renesas.
Both companies are discussing terms of business engagement that will enable 3db Access to develop new UWB products for every market space, in addition to bringing existing products to the Renesas portfolio.