StratEdge to show hermetic, Ka-band, QFN packages for 5G

October 05, 2020 //By Jean-Pierre Joosting
StratEdge to show hermetic, Ka-band, QFN packages for 5G
Technical experts from StratEdge Corporation will discuss new broadband QFN packages and a revolutionary eutectic die attach for GaN devices at the Virtual International Symposium for Microelectronics (IMAPS) 2020.

StratEdge will showcase its newly introduced line of hermetic, Ka-band, QFN packages for 5G and satellite applications at IMAPS. The thermally enhanced broadband packages have been designed for DC to 43 GHz. StratEdge offers post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages, and specializes in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices.

"Much attention is given to GaN chips, but the package in which the GaN device is attached and the way the chip is attached to the package is often overlooked," explained Casey Krawiec, VP of global sales for StratEdge Corporation. "We have developed a proprietary eutectic die attach method that produces extremely thin, low-void bond lines between the device and package heat sink."

StratEdge also provides the same service for die-on-tab. Learn more about the 6-micron thick, AuSn die attach process that produces greater than 96% coverage in StratEdge’s new white paper available at:

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